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Phase cutoff modules
▼MG071
Top surface heat dissipation package
contributes to both high heat dissipation and downsizing
▼MG031
The mounting area is reduced by about 60%
Three-phase inverter module for motor drive
Top surface heat dissipation package
contributes to both high heat dissipation and downsizing
MG071
[Under development]
■Motor drive transfer power module
■Contributes to both high heat dissipation and downsizing
■Top surface heat dissipation package
■Non-insulated type
■Cu clip connections
Still under development so contents and specifications are subject to change.
■Contributes to both high heat dissipation and downsizing
■Top surface heat dissipation package
■Non-insulated type
■Cu clip connections
Contributes to both high heat dissipation and downsizing
The top surface heat dissipation package achieves equivalent heat dissipation to 2 parallel 5×6mm packages.The mounting area can be reduced 33.5% compared to 5×6mm packages and 33.3% compared to 7×8mm packages.
This contributes to a reduction in the number of components and a reduction in mounting area.
External Dimensions
Equivalent Circuit
Product Specifications
| Part Name | VDSS [V] | ID [A] | RDS(on)typ. [mΩ] |
|---|---|---|---|
| name TBD | 40 | 250 | 0.9 |
| name TBD | 60 | 200 | 1.5 |
| name TBD | 100 | 140 | 3.5 |
The mounting area is reduced by about 60%
Three-phase inverter module for motor drive
MG031
■Internal connection structure with Cu clip
■The exposed lead frame realizes a large current capacity in a compact form
■Junction temperature (Tch) guaranteed up to 175°C Ensured the reliability required for in-vehicle products
■The mounting area is reduced by about 60% compared to the conventional product（2,200mm2 → 880mm2）
■The exposed lead frame realizes a large current capacity in a compact form
■Junction temperature (Tch) guaranteed up to 175°C Ensured the reliability required for in-vehicle products
■The mounting area is reduced by about 60% compared to the conventional product（2,200mm2 → 880mm2）
The mounting area is reduced by about 60% compared to the conventional product
Compared to mounting of discrete semiconductors, mounting the MG031 makes it possible to reduce the power component mounting area by approximately 60%.
External Dimensions
Equivalent Circuit
Product Specifications
| Part Name | Circuit | VDSS [V] | ID [A] | Vth [V] | RDS(on) max [mΩ] |
|---|---|---|---|---|---|
| MG031B090004A | 6in1 | 40 | 90 | 2.0 | 3.20 |
| MG031E120004A | 6in1 | 40 | 120 | 3.0 | 3.10 |
| MG031G148004A | 6in1 | 40 | 148 | 3.0 | 2.20 |
| MG031L080006A | 6in1 | 60 | 80 | 3.0 | 5.60 |
| MG031N110006A | 6in1 | 60 | 110 | 3.0 | 3.80 |
| MG031MC148004A | 3in1 | 40 | 148 | 3.0 | 2.20 |
| MG031MD110006A | 3in1 | 60 | 110 | 3.0 | 3.80 |
| MG031S【under development】 | 6in1 | 75 | 80 | 3.0 | 5.00 |
| MG031V【under development】 | 6in1 | 100 | 60 | 3.0 | 8.80 |
| MG031Y【under development】 | 6in1 | 120 | 47 | 3.0 | 13.0 |
| MG031AD【under development】 | 6in1 | 40 | 200 | 3.0 | 1.71 |
| MG031AF【under development】 | 6in1 | 60 | 150 | 3.0 | 2.95 |
| MG031MF【under development】 | 3in1 | 40 | 200 | 3.0 | 1.71 |
| MG031MH【under development】 | 3in1 | 60 | 150 | 3.0 | 2.95 |
