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- Inverter modules
Inverter modules
▼MG071
Top surface heat dissipation package contributes to both high heat dissipation and downsizing
▼MG055
Contributes to downsizing in micro EV vehicles, including 2 wheeled EV
▼MG031
The mounting area is reduced by about 60% Three-phase inverter module for motor drive
▼MG032
Reduced number of components contributes to space saving
▼MG048
Contributes to space saving of equipment with compact DIP package,
Three-phase inverter module for motor drive
![](https://staging.shindengen.co.jp/products/semi/files/images/MG071_1.png)
■Motor drive transfer power module
■Contributes to both high heat dissipation and downsizing
■Top surface heat dissipation package
■Non-insulated type
■Cu clip connections
Still under development so contents and specifications are subject to change.
■Contributes to both high heat dissipation and downsizing
■Top surface heat dissipation package
■Non-insulated type
■Cu clip connections
Contributes to both high heat dissipation and downsizing
The top surface heat dissipation package achieves equivalent heat dissipation to 2 parallel 5×6mm packages.The mounting area can be reduced 33.5% compared to 5×6mm packages and 33.3% compared to 7×8mm packages.
This contributes to a reduction in the number of components and a reduction in mounting area.
![](/products/semi/files/images/MG071_kouhounetu_en.png)
![](/products/semi/files/images/MG071_package_en.png)
External Dimensions
![](https://staging.shindengen.co.jp/products/semi/files/images/MG071_dimensional%20drawing.png)
Equivalent Circuit
![](https://staging.shindengen.co.jp/products/semi/files/images/MG071_Pin%20assignment.png)
Product Specifications
Part Name | VDSS [V] | ID [A] | RDS(on)typ. [mΩ] |
---|---|---|---|
name TBD | 40 | 250 | 0.9 |
name TBD | 60 | 200 | 1.5 |
name TBD | 100 | 140 | 3.5 |
![](https://staging.shindengen.co.jp/products/semi/files/images/MG055_2.png)
■Achieve miniaturization while ensuring a large capacity
■No require additional insulation
■This power module allows a reduction of the number of parallel element connections, which reduces the stress placed on some elements
■No require additional insulation
■This power module allows a reduction of the number of parallel element connections, which reduces the stress placed on some elements
Reduced package size
Package size reduced by approximately 30% compared to conventional products(MG032).
![](/products/semi/files/images/MG055_Reduced%20package%20size_en.png)
Enhanced lifespan
Epoxy resin sealing provides improved heat shock resistance which contributes to longer lifespan.
![](/products/semi/files/images/MG055_long%20life_en.png)
High heat dissipation structure
Achieves high efficiency through use of a high heat dissipation structure.
![](/products/semi/files/images/MG055_Cu_en.png)
ID-VDSSComparison graph
![](https://staging.shindengen.co.jp/products/semi/files/images/MG055_ID_VDSS.png)
Connection of control parts is simple
Box connectors allow for one-touch connection.
![](https://staging.shindengen.co.jp/products/semi/files/images/MG055_Connector.png)
External Dimensions
![](https://staging.shindengen.co.jp/products/semi/files/images/MG055_dimensional%20drawing.png)
Product Specifications
EETMOS3 Chip Mounted(Current models)
Part Name | VDSS [V] | ID [A] | RDS(on) max [mΩ] | θ(j-c) [°C/W] |
---|---|---|---|---|
MG055A | 75 | 420 | 0.63 | 0.23 |
MG055B | 100 | 320 | 1.21 | 0.23 |
MG055F | 100 | 420 | 0.64 | 0.18 |
MG055H | 150 | 320 | 1.60 | 0.18 |
MG055J | 200 | 190 | 3.30 | 0.18 |
EETMOS5 Chip Mounted(Next generation model)
Part Name | VDSS [V] | ID [A] | RDS(on) max [mΩ] | θ(j-c) [°C/W] |
---|---|---|---|---|
MG055K | 100 | 420 | 0.73 | 0.23 |
MG055N | 200 | 200 | 3.15 | 0.23 |
![](https://staging.shindengen.co.jp/products/semi/files/images/MG031_2.png)
■Internal connection structure with Cu clip
■The exposed lead frame realizes a large current capacity in a compact form
■Junction temperature (Tch) guaranteed up to 175°C Ensured the reliability required for in-vehicle products
■The mounting area is reduced by about 60% compared to the conventional product.(2,200mm2 → 880mm2)
■The exposed lead frame realizes a large current capacity in a compact form
■Junction temperature (Tch) guaranteed up to 175°C Ensured the reliability required for in-vehicle products
■The mounting area is reduced by about 60% compared to the conventional product.(2,200mm2 → 880mm2)
The mounting area is reduced by about 60% compared to the conventional product
Compared to mounting of discrete semiconductors, mounting the MG031 makes it possible to reduce the power component mounting area by approximately 60%.
![](/products/semi/files/images/MG031_Mounting%20area_en.png)
External Dimensions
![](https://staging.shindengen.co.jp/products/semi/files/images/MG031_dimensional%20drawing.png)
Equivalent Circuit
![](/products/semi/files/images/MG031_Type_en.png)
Product Specifications
Part Name | Circuit | VDSS [V] | ID [A] | Vth [V] | RDS(on) max [mΩ] |
---|---|---|---|---|---|
MG031B090004A | 6in1 | 40 | 90 | 2.0 | 3.20 |
MG031E120004A | 6in1 | 40 | 120 | 3.0 | 3.10 |
MG031G148004A | 6in1 | 40 | 148 | 3.0 | 2.20 |
MG031L080006A | 6in1 | 60 | 80 | 3.0 | 5.60 |
MG031N110006A | 6in1 | 60 | 110 | 3.0 | 3.80 |
MG031MC148004A | 3in1 | 40 | 148 | 3.0 | 2.20 |
MG031MD110006A | 3in1 | 60 | 110 | 3.0 | 3.80 |
MG031S【under development】 | 6in1 | 75 | 80 | 3.0 | 5.00 |
MG031V【under development】 | 6in1 | 100 | 60 | 3.0 | 8.80 |
MG031Y【under development】 | 6in1 | 120 | 47 | 3.0 | 13.0 |
MG031AD【under development】 | 6in1 | 40 | 200 | 3.0 | 1.71 |
MG031AF【under development】 | 6in1 | 60 | 150 | 3.0 | 2.95 |
MG031MF【under development】 | 3in1 | 40 | 200 | 3.0 | 1.71 |
MG031MH【under development】 | 3in1 | 60 | 150 | 3.0 | 2.95 |
![](https://staging.shindengen.co.jp/products/semi/files/images/MG032_2.png)
■Achieve miniaturization while ensuring a large capacity
■No require additional insulation
■This power module allows a reduction of the number of parallel element connections, which reduces the stress placed on some elements
■No require additional insulation
■This power module allows a reduction of the number of parallel element connections, which reduces the stress placed on some elements
Achieves reduction of the number of parts and space saving
![](/products/semi/files/images/MG032_Space%20saving_en.png)
External Dimensions
![](https://staging.shindengen.co.jp/products/semi/files/images/MG032_Structural%20drawing.png)
Equivalent Circuit
![](https://staging.shindengen.co.jp/products/semi/files/images/MG032_dimensional%20drawing.png)
Product Specifications
Part Name | VDSS [V] | ID [A] | Vth [V] | RDS(on) max [mΩ] |
---|---|---|---|---|
MG032A4207R5A | 75 | 420 | 3.0 | 0.98 |
MG032B420010A | 100 | 420 | 3.0 | 1.37 |
MG032D【under development】 | 120 | 360 | 3.0 | 1.82 |
MG032K【under development】 | 150 | 300 | 3.0 | 1.54 |
MG032L【under development】 | 200 | 220 | 3.0 | 3.17 |
![](https://staging.shindengen.co.jp/products/semi/files/images/MG048_2.png)
■Three-phase inverter module for motor drive
■Contributes to space saving of equipment with compact DIP package
■Lead-free, RoHS compliant
■Equipped with shunt resistance 0.5mΩ, thermistor, and snubber circuit
■Insulation is not required because the insulation package is used
■Contributes to space saving of equipment with compact DIP package
■Lead-free, RoHS compliant
■Equipped with shunt resistance 0.5mΩ, thermistor, and snubber circuit
■Insulation is not required because the insulation package is used
External Dimensions
![](https://staging.shindengen.co.jp/products/semi/files/images/MG048_dimensional%20drawing.png)
Equivalent Circuit
![](https://staging.shindengen.co.jp/products/semi/files/images/MG048_Structural%20drawing.png)
Product Specifications
Part Name | VDSS [V] | ID [A] | Vth [V] | RDS(on) max [mΩ] |
---|---|---|---|---|
MG048A150004A | 40 | 150 | 3.0 | 2.10 |
MG048B100006A | 60 | 100 | 3.0 | 2.92 |