• TOP
  • Lineup
  • New Product
  • Announcement of the Development of the Low Withstand Voltage Trench Structure MOSFET EETMOS Compact Package LF Series

New Product

New Product page

Announcement of the Development of the Low Withstand Voltage Trench Structure MOSFET EETMOS Compact Package LF Series

Jan. 16, 2018

Shindengen Electric Manufacturing Co., Ltd. (Headquartered in Otemachi, Chiyoda-ku, Tokyo, Japan) has expanded its lineup with the development of the low withstand voltage MOSFET EETMOS LF Series, which is suited for use in various consumer and vehicle mounted high current drive circuits, various power supply circuits, relay applications, and more.

1. Overview

In recent years, the automotive market has seen an increase in the number of ECU components installed as a result of the addition of new ECU such as safety devices including heads up displays, the shift to electric automobiles, and automated driving, as well as information device related components.
At the same time, there has also been an increasing focus on improving fuel consumption, and this has resulted in ever-increasing needs for more compact components aimed at making lighter weight ECU.
Shindengen was already engaged in the mass production of MOSFET which meet these needs. However, the development of the compact, high current package LF Series utilizes a new package structure and achieves both lower Ron and lower Qg than conventional products.

*EETMOS is registered trademark of Shindengen under Japanese law.

2. Features

  1. Cu clip internal structure allows for achievement of low Ron and high current in a 5×6 mm size compact package
  2. Can be used as a replacement for SOP8 and HSON type packages
  3. Covers a low withstand voltage to medium withstand voltage range of 40 V to 120 V
  4. Use of gull-wing shape for one side of lead alleviates substrate stress while plating of the tip improves provides high reliability
  5. Tj=175°C guaranteed
  6. Based on AEC-Q101 standard

【Recommended Applications】

  • Various motor drive circuits
  • Various power circuits
  • Relays, etc.

3. Development Roadmap

The 4th generation achieves a 50% reduction over the 2nd generation for performance index RDS(ON) *A

4. Product Diagram

(Can be used a replacement for 5×6 mm size packages.)

VDSS(V)
406075100120
25 P25LF12SLK
P25LF12SNK
32 P32LF10SLK
P32LF10SNK
40 P40LF12SLK
P40LF12SNK
46 P46LF7R5SLK
P46LF7R5SNK
50 P50LF10SLK
P50LF10SNK
64 P64LF6QLK
P64LF6QNK
72 P72LF7R5SLK
P72LF7R5SNK
98 P98LF6QLK
P98LF6QNK
105 P105LF4QLK
P105LF4QNK
140 P140LF4QLK
P140LF4QNK

5. Samples, Mass Production Period

For Consumers
Samples: January 2018 (planned)
Mass Production: May 2018 (planned)

For vehicle installations
Samples: June 2018 (planned)
Mass Production: December 2018 (planned)

6. Sample price

Please inquire.

7. Production Factory

Higashine Shindengen Co., Ltd. etc

8. Contact Information

Shindengen Electric Mfg. Co., Ltd.
Sales Div. Group Marketing & Sales Department
Tel +81-3-3279-4687
Fax +81-3--3279-4537
e-mail:dendeba@shindengen.co.jp

*The contents listed are as of January 2018.

Please note that the information contained in releases is current as of the date of press announcement, but may be subject to change without prior notice.

Back to Top