New Product Information Launch Announcement of TO-277A Package for Large Current Support in Cars
Jun. 9, 2017
Shindengen Electric Manufacturing Co., Ltd. (headquartered in Otemachi, Chiyoda-ku) launched sales for the small TO-277A (JEDEC name) package that can handle large currents in cars.
Cars equipped with digital features and high functionality are now largely required to have smaller parts and must support large currents. To meet these requirements, we have significantly increased the support range for currents by applying a copper clip to the internal structure for the connections. We developed the TO-277A package that has a footprint that is 50% less than our conventional TO-252 package. We mass produce our general rectifiing diodes that we initially launched and our single chip specification for two types of Schottky barrier diodes: a low IR balance type and an ultra-low IR type . Going forward, we are planning on expanding our product line, such as center tap specifications.
- Package JEDEC TO-227A
- Unit height 1.1 mm (TO-252 is about 2.6 mm)
- Tj = 175°C guarantee (Schottky barrier diode ultra low IR type SLSBD®)
- AEC-Q101 compliance
- High heat dissipation with a 0.3 mm lead thickness (JEDEC: 0.25 mm)
- Supports large currents by using connectors (soldered copper clips) in an internal connection structure
- Adopted a simple, fillet-type configuration with both anode and cathode terminals
3. Product Specifications
|Type||Product name||IF (AV)||VRPM||VF max||IR max||TI|
|SBD Low IR balance type Y-series||D5FY4R5SY||5||45||0.59||200||150|
|SBD Ultra-low IR type SLSBD®-series||D5FY4R5ST||5||45||0.74||15||175|
|General rectifier type||D10FY60VE||10||600||1.10||10||150|
4. External appearance
- *Contact us for more detailed information on the external dimensions.
5. Start of Production
6. Factory Location
Akita Shindengen Co., Ltd. etc
7. Contact Information
Shindengen Electric Mfg. Co., Ltd.
Sales Div. Group Marketing & Sales Department
* The contents listed are as of June 9, 2017
Please note that the information contained in releases is current as of the date of press announcement, but may be subject to change without prior notice.
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